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The markets of portable communications, computing and video equipment are challenging the semiconductor industry to develop increasingly smaller electronic components. Today, designers of compact electronic systems are faced with board space constraints, thus driving the requirement for alternative packaging technologies. Functional integration and miniaturization is the key to success! To aid this miniaturization campaign, a new generation of Chip Diodes from Bourns has emerged that offers the capability to provide a silicon diode with minimal packaging overhead.

Bourns offers Transient Voltage Suppressor Diodes for surge and ESD protection applications, in compact chip package DO-214AB (SMC) size format. The Transient Voltage Suppressor series offers a choice of Working Peak Reverse Voltage from 12 V up to 43 V and Breakdown Voltage up to 52.8 V.

Halogen free
Surface mount SMA package
Standoff voltage: 12 to 43 volts
PeakPulsePower: 5000 watts